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Sumeida: The first batch of production equipment was shipped out of Malaysia's sunscreen series products project. According to Sumeida, in the fourth quarter of 2024, Sumeida went all out to sprint the annual target and task, and the project of Malaysia's sunscreen series products with an annual output of 10,000 tons cooperated with Nanjing Kesi Chemical Co., Ltd. realized the first batch of production equipment delivery, adding more help to escort domestic customers to the sea. The equipment shipped this time includes storage tanks, reaction vessels, distillation columns, dryers, etc. The total cargo volume is estimated to be nearly 80,000 cubic meters, which will be used for the production of various sunscreens in customers' factories in Malaysia. In recent years, technology companies have kept up with the upsurge of enterprises going to sea in China, and are committed to providing comprehensive service solutions for Chinese enterprises going to sea. In the first three quarters of this year, the cumulative amount of mechanical and electrical equipment shipped by technology companies increased by 363% year-on-year.According to the analysis of the daily limit at noon on December 12, the Growth Enterprise Market index rose by 1.47% in half a day, and the big financial and consumer stocks collectively strengthened. Shandong Fiberglass and Rishang Group are connected with 7 boards, and one picture can be understood > >Korean Air passed the US antitrust review, clearing the way for completing the Asiana Airlines transaction.

Black hand again! The United States will raise import tariffs on solar polysilicon, silicon wafers and some tungsten products in China from the beginning of next year. The Office of the US Trade Representative issued a statement saying that the United States will raise import tariffs on solar polysilicon, silicon wafers and some tungsten products imported from China from the beginning of next year after a four-year review by the Biden administration. The tariff rate of silicon wafer and polysilicon will be increased to 50%, and the tariff rate of some tungsten products will be increased to 25%. These tariff increases will take effect on January 1, 2025. (Cailian)Black hand again! The United States will raise import tariffs on solar polysilicon, silicon wafers and some tungsten products in China from the beginning of next year. The Office of the US Trade Representative issued a statement saying that the United States will raise import tariffs on solar polysilicon, silicon wafers and some tungsten products imported from China from the beginning of next year after a four-year review by the Biden administration. The tariff rate of silicon wafer and polysilicon will be increased to 50%, and the tariff rate of some tungsten products will be increased to 25%. These tariff increases will take effect on January 1, 2025. (Cailian)Market News: NVIDIA has increased its recruitment in China, focusing on artificial intelligence to drive cars.

Treasury futures closed in early trading, with 2-year Treasury futures (TS) up 0.02%, 5-year Treasury futures (TF) up 0.04%, 10-year Treasury futures (T) up 0.09% and 30-year Treasury futures (TL) up 0.08%.The Supreme People's Procuratorate issued the prescribed guidelines to strengthen the substantive examination of technical evidence in injury cases. Recently, the Supreme People's Procuratorate issued the Provisions of the People's Procuratorate on the Substantive Examination of Technical Evidence in Injury Cases (the Working Provisions) and the Guidelines on the Special Examination of Expert Opinions on the Degree of Human Injury in Injury Cases (the Special Examination Guidelines), making efforts to strengthen the substantive examination of technical evidence in injury cases and further improving the professional and standardized level of examination and handling of injury cases.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)